Thermal degradation of a new electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

Abstract

A new electronic packaging material based on ternary system of benzoxazine, epoxy, and phenolic resins has been synthesized. Many properties of the resin can be altered by changing composition of the reacting components. In this study, thermal degradation of terpolymer has been investigated. Thermal gravimetric analysis (TGA) has been employed for determining thermal properties of the terpolymer while fourier transform infrared (FT-IR) spectroscopy is utilized for observing of structural change during the degradation process. Mechanisms of thermal degradation have been proposed. It is also proposed that the Mannich base in the terpolymer plays an important role in the thermal degradation of the terpolymer. The proposed mechanism has also been supported through the thermal degradation study of polybenzoxazine, epoxy resin, phenolic resin, copolymer of benzoxazine and epoxy resin, and copolymer of bezoxazine and phenolic resin.