Develovement of solder paste fluk

Abstract

Solder paste flux was developed for solder paste production to be used in the surface mounting technology in the electronic industries. In this study, the selected colophony was KE604, the solvent was diethylene glycol diethyl ether, the activator was succinic acid and thickening agent was ozokerite. It was found that total viscosity was increased when the solvent concentration decreased. The slump, viscosity and tackiness properties increased when the concentration of ozokerite increased. The electrical insulation resistance of solder paste flux decreased when the succinic concentration increased but the corrosion and the wetting and dewetting effect property increased. It was found that the solder paste flux composed of 61.8 wt% Ke604, 28.4 wt% diethylene glycol diethyl ether, 2.9 wt% succinic acid and 6.9 wt% ozokerite was the best formulation. It was comparable in terms of the viscosity, electrical insulation resistance, slump, tackiness, corrosion and wetting and dewetting effect properties to those of commercial available solder paste fluxes. When the solder paste flux was stored at 0-10 ℃ was better than that at 11-35 ℃.