Abstract:
The ease of processing, the high mechanical and the low dielectric properties were required for the polyimide composite. In this research, the properties of the synthesized polyimide with various amount of OAPS (Octa(Amino Phenyl) Silsesquioxane) that have well defined amine functional group were investigated. The OAPS having 4, 10 and 18 amine group with various amount of loading OAPS (50%, 75%, 100%, 125% and 150% of 0.00588 g OAPS) were added to the stoichiometric balance polyimides. The titration amount of amine in the fresh OAPS was 18 groups per OAPS and the amine groups of 10 and 4 were prepared by reactions of fresh OAPS with controlled amount of Phthalic anhydride. The PI/OAPS nanocomposites were prepared by two step method and the cooperation was confirmed by FTIR. The dielectric constants and densities of the nanocoposites were decreased as OAPS loading increase and as the amine groups per one OAPS decreased. It can be see that the best OAPS loading for the synthesized PI/OAPS films were at 100% and the dielectric constant of the films are 2.83, 3.09 and 3.19 with 4,10 and 18 amine groups per OAPS respectively. The PI/OAPS films at 100% OAPS loading showed the optimum thermal and mechanical properties. The thermal degradation temperatures (Td,5%) of the films were between 449- 460 ºC and the tensile strengths of the films were in the range of 72.1-94.4 MPa.
