Development of alumina substrate for peltier element

Abstract

The study concentrates on the research of the thermal conductivity of alumina substrate for Peltier element as a function of alumina powders, additives and sintering temperatures. Alumina substrate should have high mechanical strength and low production cost as well as good thermal conductivity. In this study AKP-30 was used as alumina powder and MgO and ZrO2 were used as additives. Alumina powder and additives were prepared by a conventional oxide mixing technique and sintered at temperature ranging from 1500 -1650 ºC. After performing the preliminary experiment, pure AKP 30 was selected as the powder for fabrication of thin tape by extrusion technique. The thermal conductivity of the AKP-30 specimens obtained was over 30 W/m•K and their mechanical strength of AKP-30 was higher than 400 MPa.