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https://cuir.car.chula.ac.th/handle/123456789/32924
| Title: | Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry |
| Other Titles: | การพัฒนาสมบัติในการนำความร้อนของกาวอีพอกซี โดยการเพิ่มสารเติมแต่งชนิดที่มีโลหะเป็นองค์ประกอบ สำหรับอุตสาหกรรมอิเล็กทรอนิกส์ |
| Authors: | Benjang Monkollertsirisuk |
| Advisors: | Ura Pancharoen Somboon Manoonsumrit |
| Other author: | Chulalongkorn University. Graduate School |
| Issue Date: | 1995 |
| Publisher: | Chulalongkorn University |
| Description: | Thesis (M.Eng.)--Chulalongkorn University, 1995 |
| Degree Name: | Master of Engineering |
| Degree Level: | Master's Degree |
| Degree Discipline: | Chemical Engineering |
| URI: | http://cuir.car.chula.ac.th/handle/123456789/32924 |
| ISBN: | 9746328379 |
| Type: | Thesis |
| Appears in Collections: | Grad - Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Benjang_mo_front.pdf | 4.42 MB | Adobe PDF | View/Open | |
| Benjang_mo_ch1.pdf | 4.35 MB | Adobe PDF | View/Open | |
| Benjang_mo_ch2.pdf | 5.28 MB | Adobe PDF | View/Open | |
| Benjang_mo_ch3.pdf | 4.29 MB | Adobe PDF | View/Open | |
| Benjang_mo_ch4.pdf | 10.28 MB | Adobe PDF | View/Open | |
| Benjang_mo_ch5.pdf | 872.76 kB | Adobe PDF | View/Open | |
| Benjang_mo_back.pdf | 6.15 MB | Adobe PDF | View/Open |
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